Πρωτότυπο IATF HDI PCB Ηλεκτρονική συναρμολόγηση PCB υψηλής συχνότητας

Άλλα Βίντεο
January 14, 2025
Category Connection: Πίνακας PCB HDI
Brief: Discover the advanced HDI PCB Board with BGA 0.3mm pitch, designed for high-performance consumer electronics. Featuring a min. core thickness of 0.05 and max. board size of 540*620, this customizable PCB ensures precision and reliability for your electronic projects.
Related Product Features:
  • BGA pitch of 0.3mm for high-density connections.
  • Min. core thickness of 0.05mm for lightweight and compact designs.
  • Max. board size of 540*620mm for versatile applications.
  • Vias aspect ratio of 16:1 for enhanced signal integrity.
  • Min. mechanical drill hole size of 0.1mm for precise component placement.
  • Min. laser drill hole size of 0.07mm for advanced precision.
  • Misalignment tolerance of +/- 0.06 for reliable layer alignment.
  • Certified with international standards including ISO9001 and IATF16949.
Ερωτήσεις:
  • What is the BGA pitch of the HDI PCB Board?
    The BGA pitch is 0.3mm, allowing for high-density connections and efficient space utilization.
  • What are the certifications for the HDI PCB Board?
    The board is certified with GJB9001C, ISO13485, ISO9001, IS045001, IATF16949, UL, ISO14001, AS9100D, and QC080000.
  • What is the delivery time for the HDI PCB Board?
    The delivery time is 2-7 days, with a supply ability of 500,000 SQM per month.